It seemed like a good idea to build a semiconductor lapping machine from an old hard drive. But there’s just something a little off about [electronupdate]’s build, and we think the Hackaday community ...
The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
It seemed like a good idea to build a semiconductor lapping machine from an old hard drive. But there’s just something a little off about [electronupdate]’s build, and we think the Hackaday community ...
ELECTROCHEMICAL polishing of wafers of semiconducting material is claimed to be faster, more efficient and to offer a 50% saving in cost over conventional methods So, 65 years ago, started a story in ...
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