Researchers in Japan have developed a new method for making 2-in wafers of diamond that could be used for quantum memory. The ultra-high purity of the diamond allows it to store a staggering amount of ...

Thin wafers support high-density integration, improved thermal performance, lower device weight, and better compatibility ...

A new technique measures free-form wafer shape, write Marco Franchi, Wooptix, and Leon van Dijk, Ronald Otten, Richard Van Haren, ASML. On-product overlay (OPO) is one of the most critical parameters ...

KAWASAKI, Japan--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power ...

Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly ...

Scalable and cost-effective on-chip light sources are essential for silicon photonics. Hybrid and heterogeneous integration of III–V light sources on silicon has already been demonstrated, but ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has unusual ...

A silicon wafer is a thin slice of crystalline silicon typically grown using the Czochralski process, which involves pulling a crystal seed from a molten silicon bath. A silicon wafer is a thin slice ...

LONDON-- (BUSINESS WIRE)--Technavio has been monitoring the fan-out wafer level packaging market and it is poised to grow by USD 1.94 billion during 2020-2024, progressing at a CAGR of over 16% during ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...